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Oxidation barriers prepared by electrochemical procedures
Šťastná, Eva ; Pouchlý, Václav (referee) ; Jan, Vít (advisor)
A process with aim to prepare an oxidically and thermal resistant layer was performed on the samples from clear aluminium (99,99+ %, VÚK čisté kovy, s. r. o.) and on the samples from clear titanium (99,95 % Goodfellow) with a layer from sputtered aluminium (99,99 %, VÚK čisté kovy, s. r. o.), An oxidic layer was prepared on the samples by anodization in the oxalic acid. The layer had fine, hexagonally organized pores with the diameter of 30 nm. During the following processing was the structure prepared for the electrochemical deposition of copper to the pores. The aim of the electrodeposition was preparation of copper nanowires deposited into the pores of the oxidic layer. The process was performed in the solution of copper sulfate and sulfuric acid in water. The controlling parameter of the deposition was voltage which had a very asymmetric period. The period had to be optimized for a successful preparation of the wires. The result of the whole process was structure with oxidic matrix whose most of the pores were filled with copper.
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Self-organized nanostructured oxide layers
Šťastná, Eva ; Pouchlý, Václav (referee) ; Jan, Vít (advisor)
Series of anodization experiments was conducted on pure aluminium (99,95 Goodfellow) substrates with the aim to map the possibilities and evaluate available techniques. Oxalic acid electrolyte was used for anodization at different voltage levels ranging from 20 to 60V, while current was always measured continuously during the experiment. The influence of substrate surface treatment, time and grain size of the substrate was documented for as anodized oxide structures using FEG-SEM. Well aligned and evenly distributed pores of the diameters ranging 20- 35 nm were achieved. Extremely fine pores down to 10 nm were achieved using the step-down technique governed by current limitation. Further post-anodizing treatment was evaluated – pore widening by chemical and electrochemical etching, which resulted in pores 80nm wide. The feasibility of electrodeposition of metallic wires directly into the AAO structure without substrate removal was evaluated. DC, AC symmetric and non-symmetric voltage setups were used. The deposition experiments results varied strongly depending on the post anodization treatment. For combination of pore-widening after anodizing with step-down stage, the deposition of copper nanowires was achieved. For simple step-down procedure, creation of very fine copper particles was realized using non-symmetric AC deposition. Further experiments and feasibility of metals electrodeposition in the AAO pores without substrate removal is discussed.
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Oxidation barriers prepared by electrochemical procedures
Šťastná, Eva ; Pouchlý, Václav (referee) ; Jan, Vít (advisor)
A process with aim to prepare an oxidically and thermal resistant layer was performed on the samples from clear aluminium (99,99+ %, VÚK čisté kovy, s. r. o.) and on the samples from clear titanium (99,95 % Goodfellow) with a layer from sputtered aluminium (99,99 %, VÚK čisté kovy, s. r. o.), An oxidic layer was prepared on the samples by anodization in the oxalic acid. The layer had fine, hexagonally organized pores with the diameter of 30 nm. During the following processing was the structure prepared for the electrochemical deposition of copper to the pores. The aim of the electrodeposition was preparation of copper nanowires deposited into the pores of the oxidic layer. The process was performed in the solution of copper sulfate and sulfuric acid in water. The controlling parameter of the deposition was voltage which had a very asymmetric period. The period had to be optimized for a successful preparation of the wires. The result of the whole process was structure with oxidic matrix whose most of the pores were filled with copper.
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Self-organized nanostructured oxide layers
Šťastná, Eva ; Pouchlý, Václav (referee) ; Jan, Vít (advisor)
Series of anodization experiments was conducted on pure aluminium (99,95 Goodfellow) substrates with the aim to map the possibilities and evaluate available techniques. Oxalic acid electrolyte was used for anodization at different voltage levels ranging from 20 to 60V, while current was always measured continuously during the experiment. The influence of substrate surface treatment, time and grain size of the substrate was documented for as anodized oxide structures using FEG-SEM. Well aligned and evenly distributed pores of the diameters ranging 20- 35 nm were achieved. Extremely fine pores down to 10 nm were achieved using the step-down technique governed by current limitation. Further post-anodizing treatment was evaluated – pore widening by chemical and electrochemical etching, which resulted in pores 80nm wide. The feasibility of electrodeposition of metallic wires directly into the AAO structure without substrate removal was evaluated. DC, AC symmetric and non-symmetric voltage setups were used. The deposition experiments results varied strongly depending on the post anodization treatment. For combination of pore-widening after anodizing with step-down stage, the deposition of copper nanowires was achieved. For simple step-down procedure, creation of very fine copper particles was realized using non-symmetric AC deposition. Further experiments and feasibility of metals electrodeposition in the AAO pores without substrate removal is discussed.
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